(a) (d) (b) (e) 1. part no. expression : (b) dimension code (c) type code (a) series code 2. configuration & dimensions : a superworld electronics (s) pte ltd 3. schematic : (d) inductance code : 1r0 = 1.0uh (e) tolerance code : m = 20%,y = 30% pg. 1 4.060.25 b c 1.00.2 d 2.00.20 e unit:m/m 4.450.25 0.760.30 (c) (f) (f) f : rohs compliant 1233 a b c d e 4. materials : p i c 0 4 1 2 h p 1 r 0 m f - 09.11.2015 smd power choke coil pic0412hp series note : specifications subject to change without notice. please check our website for latest information. 1r0 l h g pc board pattern 5.2 l 2.2 g 2.3 h (a) core (b) wire (c) terminal (e) paint (d) ink (g) (g) 11~99 : internal controlled number
superworld electronics (s) pte ltd pg. 2 6. electrical characteristics : inductance l part no. pic0412hpr10yf 0 0.10 ( h ) @ 0 a 4.3 dcr typ. @ 25c ( m ) irms ( a ) 11.5 25 ( a ) isat typ. typ. dcr ( m ) max. @ 25c 5.5 pic0412hpr22mf 0.22 6.6 8.5 20 8.0 pic0412hpr47mf 0.47 18 6.0 6.5 20 pic0412hp1r0mf 1.00 41 4.0 6.0 47 pic0412hp1r5mf 1.50 55 3.0 4.0 63.3 pic0412hp2r2mf 2.20 69.2 2.8 3.5 80 pic0412hp4r7mf 4.70 128 2.0 2.5 145 pic0412hp5r6mf 5.60 180 1.7 2.3 208 pic0412hp6r8mf 6.80 300 1.5 1.7 360 pic0412hp8r2mf 8.20 313 1.4 1.6 376 smd power choke coil note : specifications subject to change without notice. please check our website for latest information. 09.11.2015 pic0412hp series pic0412hp100mf 10.0 410 1.3 1.4 463 pic0412hp3r3mf 3.30 84 2.3 3.0 97 pic0412hpr33mf 0.33 13.6 7.0 11 16 pic0412hpr36mf 0.36 15.5 6.5 8.5 18 pic0412hpr60mf 0.60 22.5 5.3 6.0 26 PIC0412HPR68MF 0.68 32 5.0 6.0 37 pic0412hp1r2mf 1.20 48 3.5 5.0 56 pic0412hp220mf 22.0 950 0.8 1.0 1050 tolerance code : m = 20%, y = 30% g) part temperature (ambient+temp. rise) : should not exceed 125c under worst case operating conditions. e) heat rated current (irms) will cause the coil temperature rise approximately t of 40c (keep 1min) f ) saturation current (isat) will cause l0 to drop 20%. 5. general specification : c) storage temp. : -40c to +125c b) operating temp. : -40c to +125c a) test freq. : l : 100khz/1.0v h) storage condition (component in its packaging) i) temperature: -10 to 40c ii) humidity : 50~60% rh d) humidity range : 85 3% rh
superworld electronics (s) pte ltd pg. 3 7. characteristics curves : smd power choke coil note : specifications subject to change without notice. please check our website for latest information. 09.11.2015 pic0412hp series pic0412hpr10yf pic0412hpr22mf pic0412hpr47mf pic0412hpr33mf pic0412hpr36mf pic0412hpr60mf
superworld electronics (s) pte ltd pg. 4 smd power choke coil note : specifications subject to change without notice. please check our website for latest information. 09.11.2015 pic0412hp series pic0412hp1r0mf pic0412hp1r5mf pic0412hp2r2mf pic0412hp3r3mf PIC0412HPR68MF pic0412hp1r2mf
superworld electronics (s) pte ltd pg. 5 smd power choke coil note : specifications subject to change without notice. please check our website for latest information. 09.11.2015 pic0412hp series pic0412hp4r7mf pic0412hp5r6mf pic0412hp6r8mf pic0412hp8r2mf pic0412hp100mf pic0412hp220mf
superworld electronics (s) pte ltd pg. 6 smd power choke coil note : specifications subject to change without notice. please check our website for latest information. 09.11.2015 pic0412hp series 8. soldering : c) never contact the ceramic with the iron tip e) use a 20 watt soldering iron with tip diameter of 1.0mm d) 1.0mm tip diameter (max) f) limit soldering time to 4~5 secs. 8-1.2 soldering iron : in the event that a soldering iron must be employed the following precautions are recommended. products attachment with soldering iron is discouraged due to the inherent process control limitations. recommended temperature profiles for re-flow soldering in figure 1. mildly activated rosin fluxes are preferred. the minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. our terminations are suitable for re-flow soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot air a) preheat circuit and products to 150c. soldering tools 8-1.1 solder re-flow : note : b) 355c tip temperature (max) temperature c over 1min. gradual cooling within 4-5s 350 150 preheating soldering cooling natural time(sec.) 60~150s 20~40s soldering temperature c 480s max. 60~180s 150 25 tp(260c/40s max.) 217 200 preheating cooling natural figure 1. re-flow soldering: 3 times max. figure 2. iron soldering: 1 times max.
superworld electronics (s) pte ltd pg. 7 9. packaging information : bo(mm) 5.00.1 9-3. packaging quantity pic0412 series ao(mm) 4.400.1 5.50.1 f(mm) p(mm) 8.00.1 ko(mm) 1.50.1 w(mm) 12.00.3 0.350.05 t(mm) 9-2. tape dimension 12.4+2.0/-0 a(mm) 13" x 12mm type 1002.0 b(mm) d d(mm) 13.50.5 330 c(mm) embossed carrier b a cover tape 9-1. reel dimension pic0412 32000 8000 carton chip / reel inner box size 4000 2.00.5 ?c bo ko t 4.0 1.5 2.0 1.75 ao p f w 3 d/c smd power choke coil note : specifications subject to change without notice. please check our website for latest information. 09.11.2015 pic0412hp series 1r0 d/c 1r0 d/c 1r0 d/c 1r0 d/c 1r0 d/c 1r0 d/c 1r0 d/c 1r0 d/c 1r0
superworld electronics (s) pte ltd pg. 8 smd power choke coil note : specifications subject to change without notice. please check our website for latest information. 09.11.2015 pic0412hp series 9-4. tearing off force the force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions. a) products should be handled with care to avoid damage or contamination from perspiration and skin oils. 1. storage conditions : to maintain the solderabililty of terminal electrodes : a) recommended products should be used within 12 months from the time of delivery. b) the packaging material should be kept where no chlorine or sulfur exists in the air. b) vacuum pick up is strongly recommended for individual components. c) bulk handling should ensure that abrasion and mechanical shock are minimized. 2. transportation : application notice top cover tape f base tape 165 to 180 room temp. (c) 5~35 room humidity (%) 45~85 tearing speed (mm/min) 300 room atm (hpa) 860~1060 (referenced ansi/eia-481-c-2003 of 4.11 standard)
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